Abrasive jet machining is one of the promising non-traditional machining processes which uses mechanical energy (pressure and velocity) for machining various materials. The process parameters that influence the metal removal rate are kerfs, surface finish, depth of cut, air pressure, and distance between nozzle and work piece, nozzle diameter, abrasive type, abrasive shape, and mass flow rate of abrasive particles. The abrasive particles coming out with high pressure not only hits work surface but also passes through the nozzle resulting in erosion. This paper focuses mainly on the effect of different parameters on the erosion of nozzle in Abrasive jet machining. Three different types of nozzles made of sapphire, tungsten carbide, and high carbon high chromium steel (HCHCS) are used for machining glass and the erosion of these nozzles are calculated. The results are shown in tabular form and graphical representation.
CuAlO2 thin films are prepared on Si or sapphire substrate by sol-gel method using two kinds of sols. One is combination of Cu acetate and Al acetate basic, and the other is Cu nitrate and Al nitrate. In the case of acetate sol, XRD peaks of CuAlO2 observed at annealing temperature of 800-950 ºC on both Si and sapphire substrates. In contrast, in the case of the films prepared using nitrate on Si substrate, XRD peaks of CuAlO2 have been observed only at the annealing temperature of 800-850 ºC. At annealing temperature of 850ºC, peaks of other species have been observed beside the CuAlO2 peaks, then, the CuAlO2 peaks disappeared at annealing temperature of 900 °C with increasing in intensity of the other peaks. Intensity of the other peaks decreased at annealing temperature of 950 ºC with appearance of broad SiO2 peak. In the present, we ascribe these peaks as metal silicide.
Experimental study on slicing of sapphire with fixed abrasive diamond wire saw was conducted in this paper. The process parameters were optimized through orthogonal experiment of three factors and four levels. The effects of wire speed, feed speed and tension pressure on the surface roughness were analyzed. Surface roughness in cutting direction and feed direction were both detected. The results show that feed speed plays the most significant role on the surface roughness of sliced sapphire followed by wire speed and tension pressure. The optimized process parameters are as follows: wire speed 1.9 m/s, feed speed 0.187 mm/min and tension pressure 0.18 MPa. In the end, the results were verified by analysis of variance.