A city is an intertwined texture from the relationship of different components in a whole which is united in a one, so designing the whole complex and its planning is not an easy matter. By considering that a city is a complex system with infinite components and communications, providing flexible layouts that can respond to the unpredictable character of the city, which is a result of its complexity, is inevitable. Parametric design approach as a new approach can produce flexible and transformative layouts in any stage of design. This study aimed to introduce parametric design as a modern approach to respond to complex urban issues by using descriptive and analytical methods. This paper firstly introduces complex systems and then giving a brief characteristic of complex systems. The flexible design and layout flexibility is another matter in response and simulation of complex urban systems that should be considered in design, which is discussed in this study. In this regard, after describing the nature of the parametric approach as a flexible approach, as well as a tool and appropriate way to respond to features such as limited predictability, reciprocating nature, complex communications, and being sensitive to initial conditions and hierarchy, this paper introduces parametric design.
As everyday transit options are shifting from autocentric to pedestrian and bicycle oriented modes for healthy living, downtown streets are becoming more attractive places to live. However, tools and methods to measure the natural environment at the small scale of streets do not exist. Fortunately, a combination of mobile data collection technology and parametric urban design software now allows an interface to relate urban ecological conditions. This paper describes creation of an interactive tool to measure urban phenomena of air, water, and heat/light at the scale of new three-by-three block pedestrianized areas in Barcelona called Superilles. Each Superilla limits transit to the exterior of the blocks and to create more walkable and bikeable interior streets for healthy living. The research will describe the integration of data collection, analysis, and design output via a live interface using parametric software Rhino Grasshopper and the Human User Interface (UI) plugin.
Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.
Taguchi approach was applied to determine the most influential control factors which will yield better tensile strength of the joints of pulse TIG welded 70/30 Cu-Ni alloy. In order to evaluate the effect of process parameters such as pulse frequency, peak current, base current and welding speed on tensile strength of Pulsed current TIG welded 70/30 Cu-Ni alloy of 5 mm thickness, Taguchi parametric design and optimization approach was used. Through the Taguchi parametric design approach, the optimum levels of process parameters were determined at 95% confidence level. The results indicate that the Pulse frequency, peak current, welding speed and base current are the significant parameters in deciding the tensile strength of the joint. The predicted optimal values of tensile strength of Pulsed current Gas tungsten arc welding (PC GTAW) of 70/30 Cu-Ni alloy welds are 368.8MPa.